Common defects and solutions of PCB punching (9)
9. Scrap jump
(Some of the scraps sometimes jump up when punching; some enter the workpiece hole and need to be manually cleared; some jump on the lower die, which affects the normal work of punching).
Cause
The adhesion of copper foil to the substrate is poor. The copper foil on the scrap is easy to fall off when punching, and it enters the punched hole when the punch exits the concave mold.
The gap between the die is too large, and the leakage is not smooth. When the punch exits the die and discharges, the waste jumps up. 3). The die hole has an inverted cone, and the punching waste is difficult to fall, but instead jumps upward as the punch exits the die.
Solution
Strengthen the incoming inspection of substrate materials.
Reduce the gap between the concave and convex molds, and expand the leakage hole.
Repair the inverted cone of the die hole in time.
